SUBSTRATE TRANSFER METHOD AND SEMICONDUCTOR MANUFACTURING SYSTEM

Abstract: a semiconductor manufacturing system includes a plurality of transfer modules, a pass module, and one or more process modules. in a substrate transfer method, a transfer robot is controlled to transfer a substrate from one of the transfer modules to a process module connected to the other transfer module via a pass module. in the substrate transfer method, when a plurality of substrates are transferred, it is determined whether to perform one-by-one correction in which positions of a plurality of substrates are corrected on a one-by-one basis and placed on a plurality of stages of the pass module, or to perform average correction in which an average value of positions of a plurality of substrates with respect to the plurality of stages is obtained and the plurality of substrates are placed collectively.

Inventor(s): Ryota GOTO, Hiroshi HIROSE, Kiyoshi SUZUKI, Koichi MIYASHITA

CPC Classification: H01L21/67745 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

Search for rejections for patent application number 20250174478