METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MANUFACUTURED THEREOF

Abstract: a method for metallizing through-glass vias in a glass substrate includes a) cleaning a glass substrate, wherein the glass substrate having an a side surface and a b side surface opposite the a side surface and separated from the a side surface by a thickness t, and a plurality of vias extending through the glass substrate from a side surface to the b side surface; b) depositing of an adhesion layer onto both the a side surface and b side surface of the glass substrate; c) laminating of a first dry film resist (dfr) onto the adhesion layer on the a side surface and a second dfr onto the adhesion layer on the b side surface of the glass substrate; d) making a pattern on the second dfr on the b side surface, and removing the second dfr elsewhere on the b side surface; e) etching the adhesion layer on the b side surface everywhere except underneath the pattern of the second dfr on b side surface; f) removing the pattern of the second dfr from b side surface so as to expose the vias; g) applying a current to the a side surface so as to reduce copper ions into copper and maintaining the b side surface vias electrically isolated.

Inventor(s): Mandakini Kanungo, Prantik Mazumder, Rajesh Vaddi

CPC Classification: H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -)

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