SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PROCESSING APPARATUS

Abstract: disclosed is a method of processing a substrate, the method including: an etchant supply operation of supplying an etchant to remove a film on a substrate; and a removal liquid supply operation of supplying a removal liquid to remove impurities attached onto the substrate, after the etchant supply operation is performed, in which the removal liquid has conductivity in a set range.