20250174467. Substrate Processing Apparatus (SEMES ., .)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Abstract: disclosed is a substrate processing method including: loading a substrate onto a support unit positioned in a processing space of a chamber so that a patterned face of the substrate faces down; and rotating the substrate loaded onto the support unit, discharging an etchant for etching a thin film formed on the patterned face onto the patterned face of the substrate, and discharging a heating fluid onto a non-patterned face of the substrate.
Inventor(s): Min Jung KIM, Moon Sik CHOI, Sul LEE
CPC Classification: H01L21/32134 ({by liquid etching only})
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