SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Abstract: a substrate processing method according to an aspect of the present disclosure including: (a) providing a substrate having an underlying film and a resist film on the underlying film, the resist film including a first region and a second region; (b) removing at least a part of the second region to expose at least a part of a side surface of the first region; (c) forming a deposited film on at least an upper surface of the first region; and (d) removing at least a part of the deposited film and at least a part of the second region.

Inventor(s): Sho KUMAKURA, Kenta ONO, Yuta NAKANE, Tetsuya NISHIZUKA, Masanobu HONDA

CPC Classification: H01L21/31144 ({using masks})

Search for rejections for patent application number 20250174466