SUBSTRATE PROCESSING APPARATUS

Abstract: a substrate processing apparatus includes: a processing container; a temperature adjustment structure including a flow path inside a sidewall of the processing container; a shield member installed in the processing container so as to be adjacent to the flow path; a conductive member installed between the shield member and the sidewall in which the flow path is located; a buffer member having conductivity and interposed between the shield member and the conductive member; and a plurality of fixing members installed between the sidewall and the conductive member, having elasticity and conductivity, and configured to fix the conductive member so that the conductive member is pressed against the shield member.

Inventor(s): Masato SHINADA, Einstein Noel ABARRA

CPC Classification: H01J37/32651 (Gas-filled discharge tubes (heating by discharge ))

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