LIDAR Sensor System Including Integrated Modulator

Abstract: a method of forming a photonics integrated circuit (pic) includes: growing a plurality of first layers on a substrate at a first growth stage, the plurality of first layers corresponding to a first semiconductor device of two or more different semiconductor devices that are respectively configured to receive a beam from a light source and modify one or more features of the beam; etching the substrate to remove an etched portion of the plurality of first layers; and growing a plurality of second layers on the substrate in the etched portion of the first layers at a second growth stage, the plurality of second layers corresponding to a second semiconductor device, wherein a second arrangement of the plurality of second layers differs from a first arrangement of the plurality of first layers.

Inventor(s): Ashish Bhardwaj, Sen Lin, Dong Liu, Xue Liu, Andrew Steil Michaels

CPC Classification: G01S7/4816 ({of receivers alone})

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