PROBE TESTING APPARATUS, PROBE TESTING SYSTEM AND PROBE CARD

Abstract: a probe testing apparatus includes a wafer stage, a temperature sensor, a temperature adjustment mechanism, and a controller. the wafer stage includes a wafer mounting surface on which a semiconductor wafer is mounted. the temperature sensor includes a temperature observation point exposed on the wafer mounting surface, and directly measures a temperature of a rear surface of the semiconductor wafer mounted on the wafer mounting surface. the temperature adjustment mechanism adjusts a temperature of the wafer stage by heating or cooling the wafer stage. the controller controls the temperature adjustment mechanism in such a manner that a measured temperature by the temperature sensor becomes a target temperature.

Inventor(s): Hisayoshi HANAI, Masaaki TANIMURA, Koji SUZUKI

CPC Classification: G01R31/2875 (Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits ;} testing for short-circuits, discontinuities, leakage or incorrect line connection ; checking computers {or computer components} ; checking static stores for correct operation {; testing receivers or transmitters of transmission systems }))

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