SEMICONDUCTOR DIE AND CORRESPONDING METHOD

Abstract: the disclosure relates to a semiconductor die, comprising: a first diode chain having a number nof diode junctions connected in series, where n≥1; a second diode chain having a number nof diode junctions connected in series, where n≥1; the first diode chain and the second diode chain to be biased with the same current as a temperature sensor, wherein the first diode chain and the second diode chain differ from each other in their respective number n, nof junctions and/or in a doping concentration of at least one of the junctions.

Inventor(s): Markus GRÖNER, Joachim WEYERS, Ahmed MAHMOUD

CPC Classification: G01K7/015 (MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry ))

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