Substrate Processing Apparatus, Cleaning Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium

Abstract: there is provided a technique that includes: a process vessel in which a process substrate is capable of being processed; a substrate placement table on which the process substrate is placed; and a controller capable of controlling a cooling process and a cleaning process such that the cooling process of cooling an inner portion of the process vessel is performed with a cooling substrate placed on the substrate placement table when an inner temperature of the process vessel after processing the process substrate is higher than a temperature for the cleaning process of cleaning the inner portion of the process vessel, wherein an outer peripheral length of the cooling substrate is set to be shorter than that of the process substrate, and such that the cleaning process is performed when the inner temperature of the process vessel reaches a temperature at which the cleaning process is possible.

Inventor(s): Yoshitomo HASHIMOTO

CPC Classification: C23C16/4405 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion ; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. , ; metallising of glass ; metallising mortars, concrete, artificial stone, ceramics or natural stone ; enamelling of, or applying a vitreous layer to, metals ; treating metal surfaces or coating of metals by electrolysis or electrophoresis ; single-crystal film growth ; by metallising textiles ; decorating textiles by locally metallising ))

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