METHODS OF FORMING COPPER IODIDE LAYER AND STRUCTURES INCLUDING COPPER IODIDE LAYER

Abstract: a method and system for forming a copper iodide layer on a surface of a substrate are disclosed. exemplary methods include using a cyclic deposition process that includes providing a copper precursor to a reaction chamber and providing an iodine reactant to the reaction chamber. exemplary methods can further include providing a reducing agent and/or providing a dopant reactant to the reaction chamber. structures formed using the method are also described. the structures can be used to form devices, such as memory devices.

Inventor(s): Charles Dezelah, Andrea Illiberi, Varun Sharma, Bart Vermeulen, Michael Givens

CPC Classification: C23C16/30 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion ; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. , ; metallising of glass ; metallising mortars, concrete, artificial stone, ceramics or natural stone ; enamelling of, or applying a vitreous layer to, metals ; treating metal surfaces or coating of metals by electrolysis or electrophoresis ; single-crystal film growth ; by metallising textiles ; decorating textiles by locally metallising ))

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