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20250171637. Rapid Low Temperature Cu (Rohm and Haas)

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RAPID LOW TEMPERATURE CURING MOLDABLE SILICONE COMPOSITIONS

Abstract: a two-part curable silicone composition contains as separate parts: (a) a first part with an alkenyl-functional prepolymer that is a hydrosilylation reaction product of a first part pre-mixture containing a platinum hydrosilylation catalyst, alkenyl-functional linear polyorganosiloxanes, alkenyl-functional resinous polyorganosiloxanes, and a linear sih functional chain extender; and (b) a second part with a linear alkenyl-functional polyorganosiloxane, a resinous alkenyl-functional polyorganosiloxane, a resinous sih functional polyorganosiloxane crosslinker, and a hydrosilylation cure inhibitor; wherein the alkenyl-functional and sih functional components are present in the two-part curable silicone composition so as to provide a sih/c═c ratio that is 1.4 or less; and wherein the composition contains 6 weight part per million or less of platinum and 0.01 weight-percent or more hydrosilylation cure inhibitor, with concentrations based on the combined weight of the first and second parts.

Inventor(s): Andrew Shah, Zhanjie Li, Jason Suhr

CPC Classification: C08L83/06 (containing silicon bound to oxygen-containing groups ( takes precedence))

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