CURABLE SILICONE COMPOSITION

Abstract: this disclosure relates to a curable silicone composition comprising: (a) an organopolysiloxane resin having an alkenyl group in a molecule; (b) an organosiloxane oligomer having a viscosity at 25� c. of not more than 1,000 mpa�s, having at least one silicon atom-bonded alkenyl group or silicon atom-bonded hydrogen atom, and having at least one silicon atom-bonded aryl group in a molecule; (c) an organopolysiloxane having at least one alkenyl group and not having a silicon atom-bonded aryl group and siounit in a molecule, or an organopolysiloxane having at least one silicon atom-bonded hydrogen atom and not having a silicon atom-bonded aryl group in a molecule; (d) a silica filler; and (e) a hydrosilylation reaction catalyst. the composition has an excellent thixotropic property and can cure to form a transparent cured product despite containing a large quantity of an organopolysiloxane resin.

Inventor(s): Juyoung YOOK

CPC Classification: C08L83/04 (COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers , ; artificial filaments or fibres ; textile treating compositions ))

Search for rejections for patent application number 20250171635