20250171631. Resin Composit (MITSUBISHI CHEMICAL)
RESIN COMPOSITION AND MOLDED BODY
Abstract: to provide a resin composition and a molded body. the resin composition contains 2 to 15 parts by mass of an elastomer, 3 to 20 parts by mass of a hydroxy group-containing compound, and 3 to 20 parts by mass of conductive carbon, relative to 100 parts by mass of resin components including polybutylene terephthalate resin, wherein the hydroxy group-containing compound has a concentration of hydroxy group as proportion of the peak area derived from hydroxy group relative to the whole peak area in h nmr analysis [(peak area derived from hydroxy group/whole peak area)�100] in the range of 0.5 to 15.0%.
Inventor(s): Fumihiro MUTO, Takao JOUDUKA, Kazuaki TOKUMO
CPC Classification: C08L67/02 (COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers , ; artificial filaments or fibres ; textile treating compositions ))
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