CURING AGENT COMPOSITION FOR THERMOSETTING RESIN, EPOXY RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL

Abstract: provided is a curing agent composition for thermosetting resin containing a curing agent a, a curing agent b, and a curing agent c, wherein the curing agent a is an aromatic polyamine having a substituent selected from an alkyl group, an aromatic group, and a halogen group at each of two ortho positions of an amino group, the curing agent b is an aromatic polyamine that is liquid at 25� c., and the curing agent c is a monoamine having an aromatic substituent, which enables production of an epoxy resin composition having a low viscosity and a long pot life.

Inventor(s): Suguru OZAWA, Akimichi ODA, Kohei OSAKI

CPC Classification: C08G59/5033 (MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS)

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