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20250171470. Compound, Bonding Agent, Bo (Daicel)

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COMPOUND, BONDING AGENT, BONDED BODY, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY

Abstract: the present disclosure is a compound that includes, in a molecule: at least one functional group of an oh group and an oh-generating group; an organic group that contains a carbon-carbon double bond; and a triazine ring.

Inventor(s): Akihiko Happoya, Shinsuke Ishikawa, Katsuhito Mori

CPC Classification: C07F7/1804 (ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins ))

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