DEVICE MANUFACTURING METHOD, HEAD MANUFACTURING METHOD, PIEZOELECTRIC DEVICE, LIQUID DISCHARGE HEAD, LIQUID DISCHARGE APPARATUS

Abstract: a device manufacturing method for manufacturing a piezoelectric device, the device manufacturing method includes: forming a cmos element on a first surface of a substrate; forming a piezoelectric element over the first surface of the substrate on which the cmos element is formed; forming a first insulating film in a region where the piezoelectric element is formed when forming the cmos element or the piezoelectric element, forming a lower electrode layer, a piezoelectric layer, an upper electrode layer, and a second insulating film on the first insulating film when forming the piezoelectric element; and forming a cmos wiring layer of the cmos element and a piezoelectric wiring layer of the piezoelectric element after forming the cmos element and the piezoelectric element on the substrate.

Inventor(s): Makoto TANAKA

CPC Classification: B41J2/14233 ({of film type, deformed by bending and disposed on a diaphragm})

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