FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY

Abstract: this flux contains a first solvent and a thixotropic agent. the first solvent either has a viscosity of 10 pa�s or more at 30� c. or is a solid at 30� c., has a boiling point of 200� c. or more, and has a weight loss rate of less than 96 mass % when heated to 230� c. the thixotropic agent contains a polyamide that is one or more substances selected from the group consisting of condensates of an aliphatic carboxylic acid and an amine and condensates of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid, and an amine. the content of the first solvent is 30 mass % or more with respect to the total mass of flux. the content of the polyamide exceeds 2 mass % with respect to the total mass of flux.

Inventor(s): Keisuke SHINOZAKI, Kazuya KITAZAWA, Hiroaki KAWAMATA, Yuki FUJINO

CPC Classification: B23K35/3613 (Selection of non-metallic compositions, e.g. coatings, fluxes ( takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest (selection of soldering or welding materials proper ))

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