Active Solder Paste Composition for Cladding Ceramic With Copper, Method for Cladding Ceramic With Copper, and Copper-Clad Ceramic

Abstract: active solder paste compositions for cladding ceramic with copper, methods for cladding ceramic with copper, and copper-clad ceramic materials. active solder paste compositions comprise, on the basis of the total weight of the active solder paste composition, 1-20 wt % of a first metal powder and 75-94 wt % of a second metal powder, with the balance being a flux, wherein the first metal powder contains titanium hydride and the second metal powder contains a copper-phosphorus-silver alloy. the active solder paste compositions can not only decrease the silver content, but can also reduce the welding temperature. moreover, the connection strength of ti and cu is further enhanced, and the welding strength is improved, such that the material is less prone to segregation.

Inventor(s): Wei Zhou, Qiang Xu, Weiwei Liu, Lei Wu

CPC Classification: B23K35/302 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

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