MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS

Abstract: molded device packages which allow electrical contacts to coupled to a first surface of a circuit substrate such as a printed circuit board while allowing the opposite surface to remain exposed for other purposes such as bonding thermal structures such as heatsinks include electrically-conductive pillars which are bonded to the first surface of the substrate and encapsulated in molding material. the molding material can one or more cavities over disposed over the first surface of the substrate which can be evacuated or gas-filled. the electrically-conductive pillars protrude from connected manifold and are joined to each other by a frame portion of the manifold. the manifold is patterned with a masking material that protects the pillars from being etched during a selective etching process which removes the frame portion of the manifold to separate the electrically-conductive pillars from each other.

Inventor(s): Zhiwei Gong, Lakshminarayan Viswanathan, Li Li

CPC Classification: H05K1/185 (Printed circuits structurally associated with non-printed electric components ({, , , and} take precedence))

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