CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

Abstract: a circuit board includes: a first insulating layer having first and second surfaces opposing each other, and having a cavity recessed from the first surface; a first heat dissipation pattern disposed on the second surface of the first insulating layer; and a heat dissipation part connected to the first heat dissipation pattern, and protruding into the cavity by penetrating through the first insulating layer.

Inventor(s): Gyumook Kim, Sanghoon Kim, Young Kuk Ko

CPC Classification: H05K1/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)

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