METHOD FOR MANUFACTURING CONDUCTOR PLATE, CONDUCTOR PLATE, AND CONDUCTOR PLATE ASSEMBLY

Abstract: a method for manufacturing a conductor plate includes: a press process of forming a predetermined closed region by press molding and separating a predetermined bent region from the periphery of the closed region while leaving only a connection portion that is a part of the bent region; and a bending process of bending the bent region at the connection portion to laminate the bent region with the laminated region that is another region in the closed region, and developing a part of the bent region to the outside of the closed region.

Inventor(s): Katsuhide OHASHI

CPC Classification: H01R43/16 (for manufacturing contact members, e.g. by punching and by bending)

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