20250167187. Semiconductor Package Met (Taiwan Semiconductor Manufacturing , .)

SEMICONDUCTOR PACKAGE AND METHOD

Abstract: a semiconductor package includes a redistribution structure, first and second integrated circuit dies that are connected to a first side of the redistribution structure, and third and fourth integrated circuit dies that are connected on a second side, opposite to the first side, of the redistribution structure. an optical bridge die is connected between the third and fourth integrated circuit dies, to the second side of the redistribution structure, which is configured such that the first and second integrated circuit dies optically communicate through the optical bridge die.

Inventor(s): Chen-Hua Yu, Hsing-Kuo Hsia

CPC Classification: H01L25/167 (the devices being of types provided for in two or more different main groups of groups - , or in a single subclass of , , e.g. forming hybrid circuits)

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