ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING

Abstract: a package includes a die and a plurality of electronic components disposed on a top surface of the package, connected to the die by vias. the die may be encased in an over mold, with the vias transiting through the over mold. the die may be connected to an interposer through the over mold. the interposer may be affixed to a host circuit board. electronic components may be affixed to the top surface of the package and reflowed after the die is encapsulated. electronic components may be selected or tuned according to specific applications. the interposer may be at least partially encapsulated in the over mold, and one or more electronic components may be disposed on the top surface and in direct electronic communication with the interposer through corresponding vias.

Inventor(s): James B. Mayfield, Neal D. Mains, Russell C. Tawney

CPC Classification: H01L25/16 (the devices being of types provided for in two or more different main groups of groups - , or in a single subclass of , , e.g. forming hybrid circuits)

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