Wafer Level Integration of Passive Devices

Abstract: a semiconductor device is described that includes an integrated circuit coupled to a first semiconductor substrate with a first set of passive devices (e.g., inductors) on the first substrate. a second semiconductor substrate with a second set of passive devices (e.g., capacitors) may be coupled to the first substrate. interconnects in the substrates may allow interconnection between the substrates and the integrated circuit. the passive devices may be used to provide voltage regulation for the integrated circuit. the substrates and integrated circuit may be coupled using metallization.

Inventor(s): Jun Zhai

CPC Classification: H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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