MANUFACTURING METHOD OF AN ELECTRONIC CIRCUIT COMPRISING CONTACT PADS

Abstract: the present description concerns a method of manufacturing an electronic circuit comprising, in the order, the forming on a semiconductor substrate comprising a surface of at least one conductive pad extending over the surface and having sides inclined with respect to the surface, the forming of a first insulating layer on the pad, the deposition of a resin layer and the forming of an opening in the resin layer exposing the entire pad, the plasma etching of the first insulating layer in the opening, which results in the forming of first compounds on the etched edges of the first insulating layer and of second compounds on the pad, the removal of the resin layer, the removal of the first compounds, the removal of the second compounds, and the forming of a second insulating layer on the pad.

Inventor(s): Pierre BAR, Hugo AUDOUIN

CPC Classification: H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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