PACKAGE STRUCTURE

Abstract: a package structure is provided. the package structure includes a die, an encapsulant and an rdl structure. the rdl structure is disposed on the die and the encapsulant. the rdl structure includes a first dielectric structure and a first redistribution layer. the first dielectric structure includes a first dielectric material layer and a second dielectric material layer on the first dielectric material layer. the first redistribution layer is embedded in the first dielectric structure and electrically connected to the die. the redistribution layer includes a first seed layer and a first conductive layer surrounded by the first seed layer. a topmost surface of the first seed layer and a topmost surface of the first conductive layer are substantially level with a top surface of the second dielectric material layer.

Inventor(s): Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee

CPC Classification: H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers, , , ); Manufacturing methods related thereto})

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