PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

Abstract: a package structure includes a circuit substrate, a semiconductor device and a ring structure. the circuit substrate has a first region and a second region connected thereto. the circuit substrate includes at least one routing layer including a dielectric portion and a conductive portion disposed thereon. a first ratio of a total volume of the conductive portion of the routing layer within the first region to a total volume of the dielectric and conductive portions of the routing layer within the first region is less than a second ratio of a total volume of the conductive portion of the routing layer within the second region to a total volume of the dielectric and conductive portions of the routing layer within the second region. the semiconductor device is disposed over the circuit substrate within the first region, and is electrically coupled to the circuit substrate. the ring structure is disposed over the circuit substrate within the second region.

Inventor(s): Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng

CPC Classification: H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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