20250167119. Semiconductor Structu (TAIWAN SEMICONDUCTOR MANUFACTURING .)

SEMICONDUCTOR STRUCTURE

Abstract: the present disclosure provides a semiconductor structure. the semiconductor structure includes: a first layer including a plurality of first power lines; a second layer including a plurality of vfets; a third layer including a plurality of second power line; wherein the second layer is disposed between the first layer and the third layer, a first part of the vets is connected to the first power lines and a second part of the vets is connected to the second power lines.

Inventor(s): WEI-CHENG TZENG, CHING-YU HUANG, WEI-CHENG LIN, JIANN-TYNG TZENG

CPC Classification: H01L23/5286 ({Geometry or} layout of the interconnection structure {( takes precedence; algorithms )})

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