ELECTRONIC PACKAGE WITH RECESSED TERMINALS

Abstract: a power module includes a substrate that includes an electrically insulating layer. a first electrically conducting region, a second electrically conducting region, and a third electrically conducting region are each disposed on the electrically insulative layer. the electrically conducting regions are electrically isolated from each other. a plurality of high-side power switches is disposed on and electrically coupled to the first electrically conducting region. first connectors are coupled between the plurality of high-side power switches and the second electrically conductive region. a plurality of low-side power switches is disposed on and electrically coupled to the second electrically conductive region. an insulative encapsulant at least partially encapsulates power module components. the encapsulant defines a plurality of recesses disposed in a bottom surface of the power module. a plurality of electrically conductive pins extends from the bottom surface. each conductive pin is aligned with a respective recess of the plurality of recesses.

Inventor(s): Oseob Jeon

CPC Classification: H01L23/49575 (Lead-frames {or other flat leads ( takes precedence; lead frame interconnections between components )})

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