METHOD AND APPARATUS FOR DETERMINING INTERFACE SHAPE OF HEAT DISSIPATION COVER OF CHIP

Abstract: according to embodiments of the disclosure, a method and an apparatus for determining an interface shape of a heat dissipation cover of a chip are provided. the method includes: determining a first plane warping degree of a flat reference heat dissipation cover after a welding process related to a chip; adjusting an interface shape of the reference heat dissipation cover based on the first plane warping degree, to cause the adjusted interface shape to be opposite to an interface shape reflected by the first plane warping degree; determining a second plane warping degree of the reference heat dissipation cover with the adjusted interface shape after the welding process; and in response to the second plane warping degree satisfying a predetermined condition, determining the adjusted interface shape as an interface shape of the heat dissipation cover.

Inventor(s): Pengbo Duan, Chaochao Li, Zhongyong Li, Haixin Huang, Yongfu Sun, Jian Wang

CPC Classification: H01L23/3675 (Cooling facilitated by shape of device {(, , , , take precedence)})

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