MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK

Abstract: a substrate includes a center portion and a peripheral portion connected to the center portion by a flexible coupling region. a first die is mounted to an upper surface of the substrate at the center portion and a second die is mounted to the upper surface of the substrate at the peripheral portion. a heatsink includes a base plate, fins extending from an upper surface of the base plate and tabs extending from a lower surface of the base plate. the tabs of the heatsink are mounted to the upper surface of the substrate at the center portion, and the lower surface of the base plate is thermally coupled to a back of the first die. the peripheral portion is folded relative to the center portion at the flexible coupling region. an outer surface of the fin of the heatsink is thermally coupled to a back of the second device.

Inventor(s): Jefferson Sismundo TALLEDO

CPC Classification: H01L23/3672 ({Foil-like cooling fins or heat sinks (being part of lead-frames )})

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