20250167031. Carrier Substrat (Samsung Electronics ., .)

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING SAME

Abstract: a carrier substrate according to some example embodiments is a carrier substrate having a circular disk shape, and includes a first surface, a second surface opposite surface to first surface, and an inclined surface that extends along the edge of the first surface, has an inclination angle from the first surface, and is configured to reflect incident light from the second surface.

Inventor(s): Hosin SONG, Yeongkwon KO, Jiyoung PARK, Junyeong HEO

CPC Classification: H01L21/6835 ({using temporarily an auxiliary support})

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