SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract: a substrate processing apparatus includes a first processing chamber configured to collectively perform first processing on a plurality of substrates held by a substrate holder in a shelf-like shape, a load lock chamber located below the first processing chamber and having an interior communicating with an inside of the first processing chamber, and a driving mechanism configured to move the substrate holder up and down and horizontally.

Inventor(s): Manabu HONMA

CPC Classification: H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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