20250167007. E (Amkor Technology Singapore Holding .)
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ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF
Abstract: an electronic device and a manufacturing method thereof. as non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
Inventor(s): Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
CPC Classification: H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -)
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