COMMUNICATING DATA WITH STACKED MEMORY DIES

Abstract: methods, systems, and devices for communicating data with stacked memory dies are described. a first semiconductor die may communicate with an external computing device using a binary-symbol signal including two signal levels representing one bit of data. semiconductor dies may be stacked on one another and include internal interconnects (e.g., through-silicon vias) to relay an internal signal generated based on the binary-symbol signal. the internal signal may be a multi-symbol signal modulated using a modulation scheme that includes three or more levels to represent more than one bit of data. the multi-level symbol signal may simplify the internal interconnects. a second semiconductor die may be configured to receive and re-transmit the multi-level symbol signal to semiconductor dies positioned above the second semiconductor die.

Inventor(s): Robert Nasry Hasbun, Timothy M. Hollis, Jeffrey P. Wright, Dean D. Gans

CPC Classification: G06F13/1689 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models ))

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