20250164887. Process Environment Ino (Inpria)
PROCESS ENVIRONMENT FOR INORGANIC RESIST PATTERNING
Abstract: the processing of radiation patternable organometallic coatings is shown to be improved through the appropriate selection of post processing conditions between coating and development of the pattern. in particular, a coated wafer can be subjected to process delays to allow aging of the coating at various process points, in particular following irradiation. process delays can be combined and interspersed with heating steps. the atmosphere above the coated wafer at various process steps can be adjusted to obtain desired improvements in the development of the pattern. reactive gases can be beneficial with respect to improvement of coating properties.
Inventor(s): Alan J. Telecky, Jason K. Stowers, Douglas A. Keszler, Stephen T. Meyers, Peter De Schepper, Sonia Castellanos Ortega, Michael Greer, Kirsten Louthan
CPC Classification: G03F7/38 (Treatment before imagewise removal, e.g. prebaking {( takes precedence)})
Search for rejections for patent application number 20250164887
- Patent Applications
- Inpria Corporation
- CPC G03F7/38
- Alan J. Telecky of Albany OR US
- Jason K. Stowers of Corvallis OR US
- Douglas A. Keszler of Corvallis OR US
- Stephen T. Meyers of Corvallis OR US
- Peter De Schepper of Wijnegem BE
- Sonia Castellanos Ortega of Leuven BE
- Michael Greer of Corvallis OR US
- Kirsten Louthan of Philomath OR US