RESIN COMPOSITION, RESIN COMPOSITION FILM AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS

Abstract: disclosed is a resin composition including at least one polymer compound selected from the group consisting of polyamide, polyimide, polyamideimide and polybenzoxazole as a component (a), a cationic polymerizable compound as a component (b), and a photocationic polymerization initiator as a component (c), wherein the component (b) contains both an epoxy compound as a component (b1) and an oxetane compound as a component (b2). this disclosure provides a resin composition which has sufficient mechanical properties and thermal properties and is capable of forming a pattern with thick film and high aspect ratio.

Inventor(s): Keigo Kato, Kazuyuki Matsumura, Yoshiko Tateoka, Akira Shimada

CPC Classification: G03F7/0382 (Macromolecular compounds which are rendered insoluble or differentially wettable ( takes precedence; macromolecular azides ; macromolecular diazonium compounds ))

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