THREE-DIMENSIONAL PHOTONIC INTERCONNECTS

Abstract: an embodiment photonic device may include a first photonic interconnect formed over a first horizontal plane, a second photonic interconnect formed over a second horizontal plane that is vertically displaced relative to the first horizontal plane, and a photonic coupler connected to the first photonic interconnect and the second photonic interconnect. the photonic coupler may be configured such that first photonic signals that are incident on the photonic coupler from the first photonic interconnect are directed by the photonic coupler into the second photonic interconnect, and second photonic signals that are incident on the photonic coupler from the second photonic interconnect are directed by the photonic coupler into the first photonic interconnect. the photonic coupler may further include a photonic via that connects the first photonic interconnect to the second photonic interconnect and that allows photonic signals to propagate between the first photonic interconnect and the second photonic interconnect.

Inventor(s): Chen-Hua Yu, Tung-Liang Shao

CPC Classification: G02B6/12002 (of the integrated circuit kind (electric integrated circuits ))

Search for rejections for patent application number 20250164689