20250164296. Miniature Senso (Texas Instruments Incorporated)

MINIATURE SENSOR CAVITIES

Abstract: in examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. the sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. the sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.

Inventor(s): Sreenivasan Kalyani KODURI, Christopher Daniel MANACK, Leslie Edward STARK

CPC Classification: G01D11/245 ({Housings for sensors})

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