LOW BOND-TEMPERATURE HOT MELT ADHESIVE WITH HIGH IMPACT STRENGTH AND CHEMICAL RESISTANCE

Abstract: the present invention provides a hot melt adhesive, comprising polyester resins with a tg below 0� c. and frequently combined with polyester resins with a tg above 50� c. that can be applied at 80� c. or lower, having excellent impact resistance and broad chemical resistance. the hot melt adhesive of the invention is ideally suited for use in the manufacture of handheld and wearable electronic devices.

Inventor(s): Paul KURTZ, Bo SUN, Philippe SCHOTTLAND, Ewelina SZYMCZAK, Jerome MOYER, Saeid SAVARMAND

CPC Classification: C09J7/35 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine ))

Search for rejections for patent application number 20250163300