LOW-DIELECTRIC RESIN COMPOSITION

Abstract: a low-dielectric resin composition is provided. the low-dielectric resin composition includes: an epoxy resin, an active ester compound, a hardening agent, and an inorganic filler material. based on a total weight of the low-dielectric resin composition being 100 wt %, a content of the epoxy resin ranges from 5 wt % to 30 wt %, a content of the active ester compound ranges from 5 wt % to 40 wt %, a content of the hardening agent ranges from 0.1 wt % to 20 wt %, and a content of the inorganic filler material is not less than 40 wt %. a ratio of the content of the active ester compound relative to the content of the hardening agent ranges from 0.5 to 20.

Inventor(s): TE-CHAO LIAO, LI-YUN CHEN, WEI-RU HUANG, HUNG-YI CHANG, CHIA-LIN LIU

CPC Classification: C08L63/04 (COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers , ; artificial filaments or fibres ; textile treating compositions ))

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