20250163260. Low-dielectric Res (NAN YA PLASTICS)

LOW-DIELECTRIC RESIN COMPOSITION

Abstract: a low-dielectric resin composition includes an epoxy resin, an active ester compound, a modified polyphenylene ether resin, and an inorganic filler material. based on a total weight of the low-dielectric resin composition being 100 wt %, a content of the epoxy resin ranges from 5 wt % to 30 wt %, a content of the active ester compound ranges from 5 wt % to 40 wt %, a content of the modified polyphenylene ether resin ranges from 0.1 wt % to 20 wt %, and a content of the inorganic filler material is not less than 40 wt %. a ratio of the content of the active ester compound relative to the content of the epoxy resin ranges from 0.5 to 2.

Inventor(s): TE-CHAO LIAO, LI-YUN CHEN, WEI-RU HUANG, HUNG-YI CHANG, CHIA-LIN LIU

CPC Classification: C08L63/00 (Compositions of epoxy resins; Compositions of derivatives of epoxy resins)

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