20250162951. Metal-c (TONG HSING ELECTRONIC INDUSTRIES, .)
METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME
Abstract: a metal-ceramic substrate having double brazing layers and a method for manufacturing the same are provided. the metal-ceramic substrate includes a ceramic substrate layer, a conductive metal layer, and an active metal layer disposed between the ceramic substrate layer and the conductive metal layer. the active metal layer includes a first brazing layer formed from a first active metal solder and an organic dispersion medium, and a second brazing layer formed from a second active metal solder and another organic dispersion medium. the first active metal solder includes silver, copper, and a first active metal. based on a total weight of the first active metal solder being 100 wt %, an amount of the silver ranges from 10 wt % to 60 wt %. the second active metal solder includes copper and a second active metal, but is without silver.
Inventor(s): CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
CPC Classification: C04B37/026 (with metallic articles)
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