ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Abstract: an active metal brazing substrate and a method for manufacturing the same are provided. the active metal brazing substrate includes a ceramic substrate layer, an active metal layer, and a conductive metal layer. the active metal layer is disposed between the ceramic substrate layer and the conductive metal layer. the active metal layer is formed from an active metal solder and an organic dispersion medium. the active metal solder includes silver, copper, and an active metal. based on a total weight of the active metal solder being 100 wt %, an amount of the silver ranges from 10 wt % to 60 wt %. a tensile strength of the active metal brazing substrate ranges from 165 n/cm to 270 n/cm.

Inventor(s): CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG

CPC Classification: B32B9/041 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM)

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