20250162084. Laser Processing Apparat (SAMSUNG SDI ., .)
LASER PROCESSING APPARATUS AND METHOD
Abstract: a laser processing apparatus and a laser processing method are disclosed. a laser processing apparatus includes a laser generator configured to generate a laser beam, a scanner configured to process a processing target by radiating a laser output from the laser generator, a moving unit configured to move the scanner, a vision unit configured to capture an image of the processing target processed by the scanner, and a controller configured to analyze a thermal deformation trend of a processing area based on the image of the processing target captured through the vision unit, change a processing recipe based on the thermal deformation trend, and control at least one of the laser generator, the scanner, and the moving unit according to the changed processing recipe.
Inventor(s): Kyu Chul CHOI
CPC Classification: B23K31/12 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))
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