20250162070. Liquid-assisted Laser Mic (CORNING INCORPORATED)
LIQUID-ASSISTED LASER MICROMACHINING SYSTEMS AND METHODS FOR PROCESSING TRANSPARENT DIELECTRICS AND OPTICAL FIBER COMPONENTS USING SAME
Abstract: the liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. a working surface of the substrate is placed in contact with a liquid-assist medium. a pulsed laser beam is generated and separated into a plurality of beamlets that are formed into a plurality of focus spots that have a fluence to induce multiphoton absorption in the transparent dielectric material. the plurality of focus spots are moved from an initial position in the liquid-assist medium through the substrate and simultaneously moved in one or more directions perpendicular to an optical axis so that each of the plurality of focus spots independently modifies the material along a separate modification path in a continuous volume of the transparent dielectric material. the continuous volume is removed from the substrate to form a feature in the substrate. optical components formed using the processed substrate are also disclosed.
Inventor(s): David Francis Dawson-Elli, David Mark Lance, Alranzo Boh Ruffin, Alexander Mikhailovich Streltsov
CPC Classification: B23K26/067 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))
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