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20250162069. Laser Processing Apparat (SAMSUNG SDI ., .)

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LASER PROCESSING APPARATUS

Abstract: a laser processing apparatus includes a laser emitter configured to provide a laser along a scan path to a workpiece, a lens arranged below the laser emitter, and a first layer configured to supply a first blocking layer and a second blocking layer between the lens and the workpiece along the height direction, wherein the first layer includes a first sub-layer and a second sub-layer spaced apart from each other, the first sub-layer is configured to provide the first blocking layer, the second sub-layer is configured to provide the second blocking layer, the scan path is parallel to a first direction perpendicular to the height direction, and the first layer and the second layer are spaced apart along a second direction perpendicular to the height direction and intersect the first direction, with the scan path interposed therebetween.

Inventor(s): Kyuchul CHOI

CPC Classification: B23K26/066 (by using masks)

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