SUBSTRATE PROCESSING APPARATUS AND CHAMBER CLEANING METHOD

Abstract: a substrate processing apparatus includes a chamber, an upper heater, a substrate supporter, and a lower showerhead. the chamber provides a processing space in which a process for a substrate is performed. the upper heater is provided in an upper region of an interior of the chamber and is configured to supply purge gas and to heat the substrate. the substrate supporter is provided in a lower region of the interior of the chamber and is configured to support the substrate. the lower showerhead is provided in the substrate supporter and is configured to supply cleaning gas or remote plasma.

Inventor(s): Tae-Yoon KIM, Woo-Young CHUNG, Jin-Young MIN, Kwang-Hoon JUNG

CPC Classification: B08B5/00 (Cleaning by methods involving the use of air flow or gas flow ( takes precedence))

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