INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD

Abstract: an information processing apparatus () includes: an information acquisition section () configured to acquire polishing condition information including top-ring vibration information indicating vibration of a top ring in chemical mechanical polishing of the substrate and top-ring sound information indicating sound generated from the top ring in the chemical mechanical polishing of the substrate performed by a substrate processing apparatus including a polishing table rotatably supporting the polishing pad and the top ring configured to press the substrate against the polishing pad; and a state prediction section () configured to predict substrate slip-out information for the polishing condition information by inputting the polishing condition information acquired by the information acquisition section () to a learning model (a) that has been generated by machine learning that causes the learning model to learn a correlation between the polishing condition information and the substrate slip-out information indicating occurrence of slip out of the substrate on which the chemical mechanical polishing is performed.

Inventor(s): Seungho YUN

CPC Classification: B24B37/0053 (Control means for lapping machines or devices)

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